Multilayer of Ni/Cu Coating Produced Via Electroplating Process

被引：2
|
作者：
Jikan, S. S. [1 ]
Abdullah, S. S. [1 ]
Ismail, M. H. [2 ]
Ismail, N. A. [2 ]
Badarulzaman, N. A. [2 ]
机构：
[1] UTHM, Fac Sci Technol & Human Dev, Batu Pahat, Malaysia
[2] UTHM, Fac Mech & Mfg Engn, Engn Mat Alliance ENIGMA, Johor Baharu, Malaysia
来源：
4TH MECHANICAL AND MANUFACTURING ENGINEERING, PTS 1 AND 2 | 2014年 / 465-466卷
关键词：
Electroplating; Multilayer; Cu/Ni; Vickers Hardness; HARDNESS;
D O I：
10.4028/www.scientific.net/AMM.465-466.891
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Nickel (Ni)/ Copper (Cu) multilayer were deposited on Cu substrate by electroplating process using dual bath technique. Individual sample of multilayer with sublayer thicknesses of 1 mu m, 5 mu m, 10 mu m and 50 mu m have been produced. The structure of the multilayer was characterized by X-Ray Diffraction and Scanning Electron Microscopy whereas one of the mechanical properties of the samples was investigated by means of Vickers Hardness. The results showed that the surface hardness of the coated Cu substrate increases if compared to that of pure Cu substrate. Additionally, these values increased when sublayer thickness of samples were decreased.
引用
收藏
页码：891 / +
页数：2
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