共 50 条
- [32] MACHINING OF THROUGH HOLES IN NON-CONDUCTIVE ALUMINUM NITRIDE CERAMIC USING ELECTRICAL DISCHARGE MACHINING PROCESS [J]. PROCEEDINGS OF THE ASME 2020 15TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE (MSEC2020), VOL 2A, 2020,
- [33] Multiwalled Carbon Nanotube Growth Mechanism on Conductive and Non-Conductive Barriers [J]. MEMS, NANO AND SMART SYSTEMS, PTS 1-6, 2012, 403-408 : 1201 - +
- [34] Investigations at the Interface of a Multilayer Structure Made of Non-conductive and Conductive Resins [J]. 2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020), 2020, : 67 - 70
- [38] The Optimization of the Composition of Non-Conductive Film and the Lamination to Wafer [J]. 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 778 - 784
- [39] Characterisation of electrical contacts made by non-conductive adhesive [J]. 3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 345 - 350
- [40] On the Theory of low volatile non-conductive Atomic Lattice [J]. ZEITSCHRIFT FUR PHYSIK, 1932, 74 (1-2): : 1 - 17