Transient Liquid Phase Bond Reliability Evaluation of Die-attach for Power Module Packaging

被引：0
|
作者：
Billa, Laxma R. [1 ]
Wang, Yangang [1 ]
Grant, Thomas [1 ]
Li, Xiang [1 ]
Neal, Harley [1 ]
Morshed, Muhammad [1 ]
机构：
[1] Dynex Semicond Ltd, Doddington Rd, Lincoln LN6 3LF, England
来源：
2022 24TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'22 ECCE EUROPE) | 2022年
关键词：
Transient liquid phase bond; Sn-Cu; Power semiconductors; Module packaging; EVOLUTION;
D O I：
暂无
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
This paper presents the low temperature and pressure-less Sn-Cu solder technology process by means of Transient Liquid Phase (TLP) diffusion phenomena for high temperature power module packaging. The Sn-Cu diffusion process is developed for bonding a large area dies and its reliability are evaluated by the bond strength and accelerated active and passive thermal cycling tests.
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页数：7
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