Thermal conductivity of AlN and SiC thin films

被引:91
|
作者
Choi, Sun Rock
Kim, Dongsik [1 ]
Choa, Sung-Hoon
Lee, Sung-Hoon
Kim, Jong-Kuk
机构
[1] Pohang Univ Sci & Technol, Dept Mech Engn, Pohang 790784, South Korea
[2] Samsung Adv Inst Technol, MEMS Lab, Yongin 449712, South Korea
[3] Korea Inst Machinery & Mat, Dept Surface Engn, Adv Thin Film Grp, Chang Won 641010, South Korea
关键词
3 omega method; aluminum nitride; silicon carbide; thermal conductivity; thickness; thin film;
D O I
10.1007/s10765-006-0062-1
中图分类号
O414.1 [热力学];
学科分类号
摘要
The thermal conductivity of AlN and SiC thin films sputtered on silicon substrates is measured employing the 3 omega method. The thickness of the AlN sample is varied in the range from 200 to 2000 nm to analyze the size effect. The SiC thin films are prepared at two different temperatures, 20 and 500 degrees C, and the effect of deposition temperature on thermal conductivity is examined. The results reveal that the thermal conductivity of the thin films is significantly smaller than that of the same material in bulk form. The thermal conductivity of the AlN thin film is strongly dependent on the film thickness. For the case of SiC thin films, however, increased deposition temperature results in negligible change in the thermal conductivity as the temperature is below the critical temperature for crystallization. To explain the thermal conduction in the thin films, the thermal conductivity and microstructure are compared using x-ray diffraction patterns.
引用
收藏
页码:896 / 905
页数:10
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