Configurable system simulation model build comprising packaging design data

被引:3
|
作者
Anderson, HW
Kriese, H
Roesner, W
Schubert, KD
机构
[1] IBM Deutschland Entwicklung GmbH, IBM Syst & Technol Grp, D-71032 Boblingen, Germany
[2] IBM Syst & Technol Grp, Austin, TX 78758 USA
关键词
D O I
10.1147/rd.483.0367
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A high-end eServer(TM) consists of multiple microprocessor chips packaged with additional chips on a multichip module. In conjunction with memory and various I/O cards, this module is mounted on a card called a processor book, and a few of those cards on a board finally represent a major part of the system. Before the first hardware is built, simulations must be performed to verify that all of these components work together. But before we can build the simulation models, we need to find answers to many questions and to specify constraints, such as the scope of the simulation, the representation of the packaging data, the handling of cross-hierarchical connections such as cables, and the handling of passive components such as resistors and capacitors. This system model build should be as flexible as possible. System verification must be done for different system configurations (both single-processor and multiprocessor systems, one-processor book systems, and multiprocessor-book systems) with or without I/O. Therefore, not only should a configurable model build downsize the model structure, but it should provide the capability to add logic. The requirement to include special logic, such as clock macros or checker logic, is driven by the use of emulation and acceleration technology and by other speed-related elements. This paper discusses these new concepts in eServer development: a configurable simulation model build, the automatic derivation of structural model data from packaging design, and the addition of specific logic without affecting the model structure generated by the previous step.
引用
收藏
页码:367 / 378
页数:12
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