Corrosion behavior of electrodeposited Cu-Ni alloys in presence of surfactants

被引:0
|
作者
Selim, I. Z.
Shehata, O. S. [1 ]
Ayob, E. A.
机构
[1] Natl Res Ctr, Dept Phys Chem, Dokki, Egypt
[2] Nucl Author Ctr, Cairo, Egypt
来源
BULLETIN OF ELECTROCHEMISTRY | 2006年 / 22卷 / 03期
关键词
copper-nickel alloys; electrodeposition; surfactants; corrosion behaviour;
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Ni-Cd alloys have been electro-deposited from solution containing cationic CTAB, anionic SLS (sodium lauryl sulphate) and nonionicTX-100 (triton-X 100) to improve the surface quality of the specimens. Corrosion behavior of electrodeposited alloys in neutral solutions of boric acid (H3BO3) in 142000 ppm in presence of 2 ppm lithium hydroxide (LiOH) at 296K have been studied by, open circuit potential, linear polarization resistance, and potentiodynamic techniques. Anodic polarization curves show that the specimens exhibit quasi-passive region in all Ni-Cd samples in the potential region between about -200 mV and +200 mV (SCE) at which the current is approximately stable and dissolve trans-passivity above 200 mV (SCE). The results indicate that the samples prepared in presence of different concentrations of anionic surfactant SLS and nonionic surfactant TX-100 obviously inhibit the corrosion than those prepared in presence of different concentrations of cationic surfactant CTAB than those prepared from pure bath.
引用
收藏
页码:103 / 109
页数:7
相关论文
共 50 条
  • [21] Effect of corrosion on the composition of pulse-plated Cu-Ni alloys
    Roy, Sudipta, 1600, Publ by Electrochemical Soc Inc, Pennington, NJ, United States (141):
  • [22] EFFECT OF CORROSION ON THE COMPOSITION OF PULSE-PLATED CU-NI ALLOYS
    ROY, S
    MATLOSZ, M
    LANDOLT, D
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1994, 141 (06) : 1509 - 1517
  • [23] CORROSION OF CU AND CU-NI ALLOYS IN 0.5M NACL AND IN SYNTHETIC SEAWATER
    DHAR, HP
    WHITE, RE
    BURNELL, G
    CORNWELL, LR
    GRIFFIN, RB
    DARBY, R
    CORROSION, 1985, 41 (06) : 317 - 323
  • [24] COMPARISON OF MICROSTRUCTURES AND SOLIDIFICATION BEHAVIOR OF MELT-SPUN CU-NI RIBBONS AND BULK UNDERCOOLED CU-NI ALLOYS
    CAESAR, C
    KOSTER, U
    WILLNECKER, R
    HERLACH, DM
    MATERIALS SCIENCE AND ENGINEERING, 1988, 98 : 339 - 342
  • [25] Microstructure of electrodeposited Cu-Ni binary alloy films
    Mizushima, I
    Chikazawa, M
    Watanabe, T
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1996, 143 (06) : 1978 - 1983
  • [26] SURFACE SEGREGATION OF CU-NI ALLOYS
    HASHIZUME, T
    JIMBO, A
    SAKURAI, T
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03): : 818 - 819
  • [27] OPTICAL ABSORPTION OF CU-NI ALLOYS
    DREW, HD
    DOEZEMA, RE
    RESTORFF, JB
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1971, 16 (08): : 845 - &
  • [28] Influence of electrolyte pH on composition, corrosion properties and surface morphology of electrodeposited Cu-Ni alloy
    Mohan, S.
    Rajasekaran, N.
    SURFACE ENGINEERING, 2011, 27 (07) : 519 - 523
  • [29] MAGNETISM IN Cu-Ni ALLOYS.
    Mishra, Sanak
    International Journal of Magnetism, 1974, 5 (04): : 363 - 365
  • [30] INTERNAL FRICTION IN CU-NI ALLOYS
    DEY, BN
    JOURNAL OF APPLIED PHYSICS, 1964, 35 (12) : 3621 - &