Energy release rate for circular crack due to indentation in a brittle film on a ductile substrate

被引:6
|
作者
Steffensen, S. [1 ]
Jensen, H. M. [1 ]
机构
[1] Aarhus Univ, Dept Engn ENG, DK-8000 Aarhus, Denmark
关键词
Thin hard films; Indentation-induced fracture; Energy release rate; SILICON-NITRIDE BILAYERS; AMORPHOUS-CARBON FILMS; FRACTURE-TOUGHNESS; COATED SYSTEMS; THIN-FILMS; CERAMIC COATINGS; ELASTIC-MODULUS; CONTACT DAMAGE; GLASS; INDENTERS;
D O I
10.1016/j.euromechsol.2013.09.010
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
A recent method by Steffensen et al. (2013) to estimate the fracture toughness of thin, hard films uses closed-form linear elastic fracture mechanical models for an edge crack in a semi-infinite plane to calculate the energy release rate for a circumferential crack propagating from the surface of the film. Also, in the proposed model the in-plane shear stress was neglected, and it was assumed that the crack propagates perpendicular to the surface. In this paper, the accuracy of the previously proposed method for calculating the energy release rate for axisymmetric circumferential crack during indentation is investigated. Also, neglecting the in-plane shear stress and the assumed direction of crack propagation are investigated. The J-integral and the virtual crack closure technique are used to calculate the energy release rate on the basis of results from a large scale axisymmetric finite element model. Thereby, the proper geometry of the circumferential crack, plasticity in the substrate, material mismatch across the interface are included. In general, it was found that the closed-form linear elastic fracture mechanics model is sufficient for the method. (C) 2013 Elsevier Masson SAS. All rights reserved.
引用
收藏
页码:133 / 141
页数:9
相关论文
共 50 条
  • [1] Measurement of the adhesion of a brittle film on a ductile substrate by indentation
    Drory, MD
    Hutchinson, JW
    PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 1996, 452 (1953): : 2319 - 2341
  • [2] Measurement of the adhesion of a brittle film on a ductile substrate by indentation
    Proc Royal Soc London Ser A Math Phys Eng Sci, 1953 (2319-2341):
  • [3] Indentation stress-based models to predict fracture properties of brittle thin film on a ductile substrate
    Fu, Kunkun
    Chang, Li
    Ye, Lin
    Yin, Yongbai
    SURFACE & COATINGS TECHNOLOGY, 2016, 296 : 46 - 57
  • [4] Indentation Crack Initiation and Ductile to Brittle Transition Behavior of Fused silica
    Yao, Peng
    Wei, Wang
    Huang, Chuanzhen
    Wang, Jun
    Zhu, Hongtao
    Kuriyagawa, Tsunemoto
    ADVANCES IN ABRASIVE TECHNOLOGY XVI, 2013, 797 : 667 - +
  • [5] Energy-release rate and crack kinking in anisotropic brittle solids
    Azhdari, A
    NematNasser, S
    JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 1996, 44 (06) : 929 - 951
  • [6] Energy-release rate and crack kinking in anisotropic brittle solids
    Univ of California, La Jolla, United States
    J Mech Phys Solids, 6 (929-951):
  • [7] A fracture toughness model for brittle coating on ductile substrate under indentation loading
    Demidova, N. V.
    Wu, X. J.
    Liu, R.
    ENGINEERING FRACTURE MECHANICS, 2012, 82 : 17 - 28
  • [8] ENERGY-RELEASE RATE FOR 3-DIMENSIONAL DUCTILE CRACK CONFIGURATION
    WILL, P
    ZEITSCHRIFT FUR ANGEWANDTE MATHEMATIK UND MECHANIK, 1984, 64 (08): : 367 - 368
  • [9] BRITTLE-TO-DUCTILE TRANSITION STUDIED BY CONSTANT-RATE INDENTATION CRACKING
    MAEDA, K
    NISHIOKA, H
    NARITA, N
    FUJITA, S
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1994, 176 (1-2): : 121 - 126
  • [10] Brittle-to-ductile transition studied by constant-rate indentation cracking
    Maeda, K.
    Nishoika, H.
    Narita, N.
    Fujita, S.
    1600, Publ by Elsevier Sequoia SA, Lausanne, Switzerland (A176): : 1 - 2