共 50 条
- [2] Finite Element Modelling of Cure-dependent Mechanical Properties by Model-free Kinetic Analysis Using a Cohesive Zone Approach JOURNAL OF ADHESION, 2016, 92 (7-9): : 572 - 585
- [3] Finite element modelling of cure-dependent mechanical properties by model-free kinetic analysis using a cohesive zone approach Journal of Adhesion, 2016, 92 (7-9): : 572 - 585
- [7] Investigation on flip chip solder joint fatigue with cure-dependent underfill properties IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (02): : 388 - 398
- [9] Parameter sensitivity study of cure-dependent underfill properties on flip chip failures 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 865 - 872