Coupling model for the two orthogonal microstrip lines in two layer PCB board (quasi-TEM approach)

被引：11
|
作者：
Hashemi-Nasab, M. [1 ]
Cheldavi, A. [1 ]
机构：
[1] Iran Univ Sci & Technol, Coll Elect Engn, Tehran, Iran
来源：
PROGRESS IN ELECTROMAGNETICS RESEARCH-PIER | 2006年 / 60卷
关键词：
D O I：
10.2528/PIER05040601
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the present paper a simple model has been given to simulate the signal propagation through two cross orthogonal microstrip lines in two different layers of the PCB board. First the structure has been analyzed using full wave software like HFSS, then a simple and suitable lumped equivalent circuit is proposed for the cross talk region and its parameters are obtained. Finally the sparameters of this equivalent circuit compared with the results of full wave simulations. The results show good agreement up to some GHz.
引用
收藏
页码：153 / 163
页数：11
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