Synthesis and Microwave Dielectric Properties of BBSZ-Zinc Silicate Based Material for LTCC Applications

被引:9
|
作者
Deshmukh, Ravindra [1 ]
Chaware, Varsha [1 ]
Ratheesh, R. [2 ]
Phatak, Girish J. [1 ]
机构
[1] Ctr Mat Elect Technol C MET, Pune 411008, Maharashtra, India
[2] Ctr Mat Elect Technol C MET, Hyderabad 500051, Telangana, India
关键词
LTCC; sintering; dielectric constant; dielectric loss factor; microwave materials; TEMPERATURE; GLASS; SYSTEM;
D O I
10.1007/s11664-020-08631-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The microwave dielectric properties and microstructures of zinc silicate (Zn2SiO4) ceramic with the addition of 5-20 wt.% B2O3-Bi2O3-SiO2-ZnO (BBSZ) glass have been studied for low-temperature co-fired ceramic (LTCC) applications. BBSZ glass helps in reducing the sintering temperature of zinc silicate (ZS) from about 1350 degrees C to around 900 degrees C in the form of ZS-glass composites. The zinc silicate powder was prepared following solid-state reaction technique, while BBSZ glass was prepared by standard melting and quenching method. Expectedly, the sintering studies indicate increasing sintered density between 91% and 97% with increasing sintering temperature from 875 degrees C to 950 degrees C. The sintering density is also seen to increase with increasing content of BBSZ, indicating liquid-phase sintering of the composites. Higher glass content in the composite leads to increased dielectric constant as well as dielectric loss. The results indicate that ZS with the addition of 5 wt.% of BBSZ glass, sintered at 925 degrees C for 3 h, exhibits good microwave dielectric properties with a dielectric constant (epsilon(r)) of 6.5 and quality factor (Q x f) of 20,754 GHz, which is suitable for LTCC applications.
引用
收藏
页码:1323 / 1330
页数:8
相关论文
共 50 条
  • [1] Synthesis and Microwave Dielectric Properties of BBSZ-Zinc Silicate Based Material for LTCC Applications
    Ravindra Deshmukh
    Varsha Chaware
    R. Ratheesh
    Girish J. Phatak
    Journal of Electronic Materials, 2021, 50 : 1323 - 1330
  • [2] Low temperature sintering and microwave dielectric properties of zinc titanate ceramics for LTCC applications
    Liu, Zhongchi
    Zhou, Dongxiang
    Gong, Shuping
    HIGH-PERFORMANCE CERAMICS V, PTS 1 AND 2, 2008, 368-372 : 179 - 182
  • [3] Microstructure and microwave dielectric properties of Ni doped zinc borate ceramics for LTCC applications
    Peng, Rui
    Su, Hua
    Li, Yuanxun
    Lu, Yongcheng
    Yu, Chengyong
    Shi, Liang
    Chen, Daming
    Liao, Bin
    JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 868
  • [4] Microwave dielectric properties of green tape for LTCC applications
    Abhilash, P.
    Thomas, Dhanesh
    Sebastian, M. T.
    Murthy, V. R. K.
    2011 IEEE APPLIED ELECTROMAGNETICS CONFERENCE (AEMC 2011), 2011,
  • [5] Novel zinc manganese oxide-based microwave dielectric ceramics for LTCC applications
    Cao, Qing-Song
    Lu, Wen-Zhong
    Wang, Xiao-Chuan
    Zhu, Jian-Hua
    Ulla, Burhan
    Lei, Wen
    CERAMICS INTERNATIONAL, 2015, 41 (07) : 9152 - 9156
  • [6] Sintering and microwave dielectric properties of LTCC-zinc titanate multilayers
    Zhang, QL
    Yang, H
    Zou, JL
    Wang, HP
    MATERIALS LETTERS, 2005, 59 (8-9) : 880 - 884
  • [7] Synthesis and investigation of dielectric properties of nanoceramic composite material for microwave applications
    Siragam, Srilali
    Dubey, Raghvendra S.
    Pappula, Lakshman
    MICRO & NANO LETTERS, 2020, 15 (15) : 1156 - 1161
  • [8] Modulation of magnetic and dielectric properties of La-substituted barium ferrite based on BBSZ for microwave device applications.
    Lei, Yida
    Li, Jie
    Zhang, Huaiwu
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [9] A new microwave dielectric ceramic for LTCC applications
    Zeng, Q
    Li, W
    Shi, JL
    Guo, JK
    Zuo, MW
    Wu, WJ
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2006, 89 (05) : 1733 - 1735
  • [10] A new microwave dielectric ceramic for LTCC applications
    Zhou, Huanfu
    Chen, Xiuli
    Fang, Liang
    Hu, Changzheng
    Wang, Hong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2010, 21 (08) : 849 - 853