High-Frequency Modeling of Metal Fill Eddy-Current Loss in Integrated Circuits

被引：0
|
作者：
Gaskill, Steven G. [1 ]
Shilimkar, Vikas S. [1 ]
Weisshaar, Andreas [1 ]
机构：
[1] Oregon State Univ, Sch Elect Engn & Comp Sci, Corvallis, OR 97331 USA
来源：
2013 EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2013年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a fast basis-function-based table lookup approach to account for the eddy current losses due to metal fill in spatially varying magnetic fields. This approach enables the accurate prediction of the change in resistance and inductance due to metal fill in close proximity to interconnects, spiral inductors, and other passive components over a wide range of frequencies and dimensions. The approach is compared to the simulation of a 50 Omega on-chip microstrip transmission line with surrounding 50% density metal fill. Our method captures the change in resistance with less than 2% error at 100 GHz.
引用
收藏
页码：975 / 978
页数：4
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