SIMULATIONS OF LIQUID FILM FLOWS WITH FREE SURFACE ON ROTATING SILICON WAFERS (ROWAFLOWSIM)

被引:0
|
作者
Junk, Markus [1 ]
Holsteyns, Frank [1 ]
Staudegger, Felix [1 ]
Lechner, Christiane [2 ]
Kuhlmann, Hendrik [2 ]
Prielin, Doris [3 ]
Steiner, Helfried [3 ]
Gschaider, Bernhard [4 ]
Vita, Petr [5 ]
机构
[1] Lam Res AG, Villach, Austria
[2] Vienna Univ Technol, Inst Fluid Mech & Heat Transfer, Vienna, Austria
[3] Graz Univ Technol, Inst Fluid Mech & Heat Transfer, Graz, Austria
[4] ICE Stromungsforsch GmbH, Leoben, Austria
[5] Univ Leoben, Dept Mineral Resources & Petr Engn, Leoben, Austria
来源
10TH INTERNATIONAL CONFERENCE ON MODELING AND APPLIED SIMULATION, MAS 2011 | 2011年
关键词
two-phase flow; thin-film approximation; particle removal; immersed boundary method; IMMERSED BOUNDARY METHOD; CONTACT;
D O I
暂无
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
For application in the semi-conductor industries, the flow on a rotating disk (wafer) is studied numerically. A systematic validation of available variations of the Volume-of-Fluid (VoF) scheme for this two-phase flow problem is done. To make larger parameter variations of this problem with a moving fluid supply possible, a code based on the thin-film approximation is developed. To better understand possible physical mechanisms for the removal of nano-particulate contaminations from a wafer, another code to study the detachment of submicron particles exposed to shear flows is developed and validated. An immersed boundary method with direct forcing is implemented. The particle-wall interaction is treated with a soft contact model.
引用
收藏
页码:149 / 154
页数:6
相关论文
共 50 条