SIMULATIONS OF LIQUID FILM FLOWS WITH FREE SURFACE ON ROTATING SILICON WAFERS (ROWAFLOWSIM)

被引：0

作者：

Junk, Markus ^{[1
]}

Holsteyns, Frank ^{[1
]}

Staudegger, Felix ^{[1
]}

Lechner, Christiane ^{[2
]}

Kuhlmann, Hendrik ^{[2
]}

Prielin, Doris ^{[3
]}

Steiner, Helfried ^{[3
]}

Gschaider, Bernhard ^{[4
]}

Vita, Petr ^{[5
]}

机构：

[1] Lam Res AG, Villach, Austria

[2] Vienna Univ Technol, Inst Fluid Mech & Heat Transfer, Vienna, Austria

[3] Graz Univ Technol, Inst Fluid Mech & Heat Transfer, Graz, Austria

[4] ICE Stromungsforsch GmbH, Leoben, Austria

[5] Univ Leoben, Dept Mineral Resources & Petr Engn, Leoben, Austria

来源：

10TH INTERNATIONAL CONFERENCE ON MODELING AND APPLIED SIMULATION, MAS 2011 | 2011年

关键词：

two-phase flow; thin-film approximation; particle removal; immersed boundary method; IMMERSED BOUNDARY METHOD; CONTACT;

D O I：

暂无

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

For application in the semi-conductor industries, the flow on a rotating disk (wafer) is studied numerically. A systematic validation of available variations of the Volume-of-Fluid (VoF) scheme for this two-phase flow problem is done. To make larger parameter variations of this problem with a moving fluid supply possible, a code based on the thin-film approximation is developed. To better understand possible physical mechanisms for the removal of nano-particulate contaminations from a wafer, another code to study the detachment of submicron particles exposed to shear flows is developed and validated. An immersed boundary method with direct forcing is implemented. The particle-wall interaction is treated with a soft contact model.

引用

页码：149 / 154

页数：6

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