Characterization of electrical contacts on silicon (100) after ablation and sulfur doping by femtosecond laser pulses

被引:1
|
作者
Saring, P. [1 ]
Baumann, A. L. [2 ]
Kontermann, S. [2 ]
Schade, W. [2 ,3 ]
Seibt, M. [1 ]
机构
[1] Univ Gottingen, Inst Phys 4, Friedrich Hund Pl 1, D-37077 Gottingen, Germany
[2] Fraunhofer Heinrich Hertz Inst, D-38640 Goslar, Germany
[3] Tech Univ Clausthal, EFZN, D-38640 Goslar, Germany
关键词
Black Silicon; femtosecond laser processing; sulfur doping; EBIC; TEM; INFRARED-ABSORPTION;
D O I
10.4028/www.scientific.net/SSP.205-206.358
中图分类号
O59 [应用物理学];
学科分类号
摘要
This paper investigates the influence of different number of laser pulses on contact behavior and conductivity of the surface layer of femtosecond laser microstructured, sulfur-doped silicon. Single shot laser processed silicon (Pink Silicon) is characterized by low surface roughness, whereas five shot laser processed silicon (Grey Silicon) has an elevated sulfur content with a surface roughness low enough to maintain good contacting. To laterally confine the laser induced pn-junction part of the Grey Silicon sample surface is etched off. The etching depth is confirmed to be sufficient to completely remove the active n-type sulfur layer. While Pink Silicon shows little or no lateral conductivity within the laser processed layer, Grey Silicon offers acceptable conductivity, just as expected by the fact of having incorporated a higher sulfur dopant content. Recombination dominates the irradiated regions of Pink Silicon and suppresses excess charge carrier collection. Grey Silicon, while showing sufficient lateral conductivity, still shows regions of lower conductivity, most likely dominated by the laser irradiation-induced formation of dislocations. According to our results, the optimum laser pulse number for electrical and structural properties is expected to be in the range between one and five laser pulses.
引用
收藏
页码:358 / +
页数:2
相关论文
共 50 条
  • [1] Ablation of silicon with bursts of femtosecond laser pulses
    Gaudiuso, Caterina
    Kaemmer, Helena
    Dreisow, Felix
    Ancona, Antonio
    Tuennermann, Andreas
    Nolte, Stefan
    FRONTIERS IN ULTRAFAST OPTICS: BIOMEDICAL, SCIENTIFIC, AND INDUSTRIAL APPLICATIONS XVI, 2016, 9740
  • [2] Laser ablation of silicon with THz bursts of femtosecond pulses
    Caterina Gaudiuso
    Pavel N. Terekhin
    Annalisa Volpe
    Stefan Nolte
    Bärbel Rethfeld
    Antonio Ancona
    Scientific Reports, 11
  • [3] Laser ablation of silicon with THz bursts of femtosecond pulses
    Gaudiuso, Caterina
    Terekhin, Pavel N.
    Volpe, Annalisa
    Nolte, Stefan
    Rethfeld, Baerbel
    Ancona, Antonio
    SCIENTIFIC REPORTS, 2021, 11 (01) : 13321
  • [4] Laser ablation of silicon in water with nanosecond and femtosecond pulses
    Ren, J
    Kelly, M
    Hesselink, L
    OPTICS LETTERS, 2005, 30 (13) : 1740 - 1742
  • [5] Microstructuring and doping of monocrystalline silicon with femtosecond and nanosecond laser pulses
    Wen, Cai
    Li, Xiaohong
    He, Xiaoqing
    Duan, Xiaofeng
    Qiu, Rong
    Liu, Dexiong
    Tang, Jinlong
    Hu, Sifu
    Qiangjiguang Yu Lizishu/High Power Laser and Particle Beams, 2015, 27 (02):
  • [6] Laser ablation of silicon dioxide on silicon using femtosecond near infrared laser pulses
    Rublack, Tino
    Muchow, Markus
    Hartnauer, Stefan
    Seifert, Gerhard
    PROCEEDINGS OF THE SILICONPV 2011 CONFERENCE (1ST INTERNATIONAL CONFERENCE ON CRYSTALLINE SILICON PHOTOVOLTAICS), 2011, 8 : 467 - 472
  • [7] Doping effects on ablation enhancement in femtosecond laser irradiation of silicon
    Fang, Juqiang
    Jiang, Lan
    Cao, Qiang
    Zhang, Kaihu
    Yuan, Yanping
    Lu, Yongfeng
    APPLIED OPTICS, 2014, 53 (18) : 3897 - 3902
  • [8] Microscopic characterization of ablation craters produced by femtosecond laser pulses
    Temnov, VV
    Sokolowski-Tinten, K
    Stojanovic, N
    Kudryashov, S
    von der Linde, D
    Kogan, B
    Schlarb, A
    Weyers, B
    Möller, R
    Seekamp, J
    Sotomayor-Torres, C
    HIGH-POWER LASER ABLATION IV, PTS 1 AND 2, 2002, 4760 : 1032 - 1039
  • [9] Ablation and cutting of planar silicon devices using femtosecond laser pulses
    Bärsch, N
    Körber, K
    Ostendorf, A
    Tönshoff, KH
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2003, 77 (02): : 237 - 242
  • [10] Ablation and cutting of planar silicon devices using femtosecond laser pulses
    Bärsch, N.
    Körber, K.
    Ostendorf, A.
    Tönshoff, K.H.
    Applied Physics A: Materials Science and Processing, 2003, 77 (02): : 237 - 242