MTI focal plane assembly design and performance

被引:10
|
作者
Rienstra, JL [1 ]
Ballard, M [1 ]
机构
[1] Sandia Natl Labs, Albuquerque, NM 87185 USA
来源
IMAGING SPECTROMETRY V | 1999年 / 3753卷
关键词
multispectral imaging; focal plane arrays; remote sensing;
D O I
10.1117/12.366299
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
The focal plane assembly for the Multispectral Thermal Imager (MTI) consists of sensor chip assemblies, optical filters, and a vacuum enclosure. Sensor chip assemblies, composed of linear detector arrays and readout integrated circuits, provide spatial resolution in the cross-track direction for the pushbroom imager. Optical filters define 15 spectral bands in a range from 0.45 mu m to 10.7 mu m. All the detector arrays are mounted on a single focal plane and are designed to operate at 75 K. Three pairs of sensor chip assemblies (SCAs) are required to provide cross-Crack coverage in all 15 spectral bands. Each pair of SCAs includes detector arrays made from silicon, indium antimonide, and mercury cadmium telluride. Readout integrated circuits multiplex the signals from the detectors to 18 separate video channels. Optical filter assemblies defining the spectral bands are mounted over the linear detector arrays. Each filter assembly consists of several filter strips bonded together side-by-side. The MTI focal plane assembly has been integrated with the rest of the payload and has undergone detailed testing and calibration. This paper includes representative rest data for the various spectral bands and the overall performance of the focal plane assembly.
引用
收藏
页码:369 / 379
页数:11
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