Effects of thermal-via structures on thin-film VCSELs for fully embedded board-level optical interconnection system

被引：18
|
作者：
Choi, J. H. [1 ]
Wang, L. [1 ]
Bi, H. [1 ]
Chen, R. T. [1 ]
机构：
[1] Univ Texas, Dept Elect & Comp Engn, Ctr Microelect Res, Austin, TX 78712 USA
来源：
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 2006年 / 12卷 / 05期
基金：
美国国家科学基金会;
关键词：
fully embedded optical interconnection; printed circuit board (PCB); self-heat generation; thermal-electric coupled field analysis; thermal resistance; thermal via; thin-film vertical-cavity surface-emitting laser (VCSEL); SURFACE-EMITTING LASERS;
D O I：
10.1109/JSTQE.2006.881903
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The thermal characteristics of a thin-film vertical-cavity surface-emitting laser (VCSEL) are studied both theoretically and experimentally. The thermal resistances of the VCSEL with variable thickness, ranging from 10 to 200 mu m, have been determined by measuring the output wavelength shift as a function of the dissipated power. The thermal simulation results agree reasonably well with the experimentally measured data. From the thermal management viewpoint, a thinned VCSEL has an exclusive advantage due to the reduction of the thermal resistance. The thermal resistance of a 10-mu m-thick VCSEL is 40% lower than that of a 200-mu m-thick VCSEL. A theoretical analysis of the thermal-via effects is performed to determine the optimized thickness range of thin-film VCSEL for the fully embedded structure. The thermal resistance of the fully embedded thin-film VCSEL with closed and open thermal-via structures is also evaluated, and the suitable VCSEL thickness is reported.
引用
收藏
页码：1060 / 1065
页数：6
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