共 50 条
- [41] Numerical simulation of surface diffusion controlled motion and shape change of electromigration voids MATERIALS RELIABILITY IN MICROELECTRONICS VI, 1996, 428 : 161 - 166
- [44] Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects MATERIALPRUFUNG, 2004, 46 (10): : 513 - 516
- [48] Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration Journal of Electronic Materials, 2008, 37 : 962 - 967