Dispersive processes in the annealing of light- and thermally-induced dangling bonds in a-Si:H

被引:0
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作者
Takeda, K
Hikita, H
Kimura, Y
Yokomichi, H
Morigaki, K
机构
[1] ELECTROCHEM & CANC INST,CHOFU,TOKYO 182,JAPAN
[2] MEIKAI UNIV,PHYS LAB,URAYASU,CHIBA 279,JAPAN
[3] TOKAI UNIV,HIRATSUKA,KANAGAWA 25912,JAPAN
[4] TOYAMA PREFECTURAL UNIV,FAC ENGN,TOYAMA 93903,JAPAN
[5] HIROSHIMA INST TECHNOL,DEPT ELECT ENGN,SAEKI KU,HIROSHIMA 73151,JAPAN
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暂无
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The annealing of light- and thermally-induced dangling bonds in a-Si:H exhibits a dispersive kinetics whose time dependence is expressed by a stretched exponential function. The annealing-temperature dependence of the dispersion parameter for both types of dangling bonds is discussed.
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收藏
页码:486 / 489
页数:4
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