Screwed micro fluidic connections fabricated by ultrasonic hot embossing and welding

被引:0
|
作者
Lee, H-J [1 ,2 ]
Sackmann, J. [1 ]
Park, K. [2 ]
Schomburg, W. K. [1 ]
机构
[1] Rhein Westfal TH Aachen, Konstrukt & Entwicklung Mikrosyst, Campus Blvd 30, D-52074 Aachen, Germany
[2] Seoul Natl Univ Sci Technol, Dept Mech Syst Design Engn, 172 Gongneung, Seoul 01811, South Korea
关键词
INTERCONNECTS;
D O I
10.1007/s00542-018-4236-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recent connection methods to micro fluidic chips, such as gluing tubes and hoses into orifices or pressing a gasket on them have been studied to improve the common problem to establish a connection of the macroscopic world to a fluidic micro system. In this study, micro fluidic chips from polycarbonate plates with screwed connections have been fabricated by ultrasonic hot embossing and welding, both as in plain and out of plain arrangements. To fabricate threads in the polymer plates, an M3 screw was ultrasonically welded into a hole in the chip and the screw was turned out after the process. The tightness of micro channels and fittings was proven by pumping ink and yeast cells through the micro channels and by applying air pressure of up to 700 kPa, respectively. The process introduced here is especially advantageous because sealing micro channels and welding in micro fluidic screwed connections is done in a single fabrication step.
引用
收藏
页码:3825 / 3834
页数:10
相关论文
共 50 条
  • [1] Screwed micro fluidic connections fabricated by ultrasonic hot embossing and welding
    H.-J. Lee
    J. Sackmann
    K. Park
    W. K. Schomburg
    Microsystem Technologies, 2019, 25 : 3825 - 3834
  • [2] Development of ultrasonic micro hot embossing technology
    Mekaru, Harutaka
    Goto, Hiroshi
    Takahashi, Masaharu
    MICROELECTRONIC ENGINEERING, 2007, 84 (5-8) : 1282 - 1287
  • [3] Polymer circuit boards fabricated by ultrasonic hot embossing
    Li, J.
    Gerhardy, C.
    Schomburg, W. K.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2013, 23 (07)
  • [4] Ultrasonic Hot Embossing
    Schomburg, Werner Karl
    Burlage, Katharina
    Gerhardy, Christof
    MICROMACHINES, 2011, 2 (02): : 157 - 166
  • [5] Hot embossing of micro energy director for micro polymer fusion ultrasonic bonding
    罗怡
    张彦国
    张宗波
    Journal of Harbin Institute of Technology(New series), 2011, (06) : 139 - 142
  • [6] Hot embossing of micro energy director for micro polymer fusion ultrasonic bonding
    Luo, Yi
    Zhang, Yan-Guo
    Zhang, Zong-Bo
    Journal of Harbin Institute of Technology (New Series), 2011, 18 (06) : 139 - 142
  • [7] Hot embossing of micro energy director for micro polymer fusion ultrasonic bonding
    罗怡
    张彦国
    张宗波
    Journal of Harbin Institute of Technology, 2011, 18 (06) : 139 - 142
  • [8] Tools for ultrasonic hot embossing
    Liao, S.
    Gerhardy, C.
    Sackmann, J.
    Schomburg, W. K.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (07): : 1533 - 1541
  • [9] Tools for ultrasonic hot embossing
    S. Liao
    C. Gerhardy
    J. Sackmann
    W. K. Schomburg
    Microsystem Technologies, 2015, 21 : 1533 - 1541
  • [10] Ultrasonic welding of polymer micro fluidic devices by inserting metal parts
    Hoehr, L.
    Bavendiek, J.
    Sackmann, J.
    Schomburg, W. K.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2019, 25 (02): : 673 - 681