Initial Experience with 3D XPoint Main Memory

被引：9
|
作者：
Liu, Jihang [1 ]
Chen, Shimin [1 ]
机构：
[1] Chinese Acad Sci, Univ Chinese Acad Sci, Inst Comp Technol, State Key Lab Comp Architecture, Beijing, Peoples R China
来源：
2019 IEEE 35TH INTERNATIONAL CONFERENCE ON DATA ENGINEERING WORKSHOPS (ICDEW 2019) | 2019年
关键词：
RANDOM-ACCESS MEMORY;
D O I：
10.1109/ICDEW.2019.00009
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
3D XPoint will likely be the first commercially available main memory NVM solution targeting mainstream computer systems. Previous database studies on NVM memory evaluate their proposed techniques mainly on simulated or emulated NVM hardware. In this paper, we report our initial experience experimenting with the real 3D XPoint main memory hardware.
引用
收藏
页码：300 / 305
页数：6
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