Simulation of switching noise in multi-layer structures using generalized transmission line equation method

This paper discusses the use of the Generalized Transmission Line Equations (GTLE) for the simulation of switching noise distribution in multi-layered packaging structures. After a brief discussion on the formulation and its application to a simple dual trace transmission line, two-layered plane and two-layered plane with four drivers and traces, the method has been applied to a complicated fourteen-layer structure which consists of the pack-age and board power distribution. This structure includes non-ideal decoupling capacitors placed on the package/board, vias connecting the planes, drivers and traces. This paper demonstrates the advantage of the GTLE method over SPICE in terms of efficiency and accuracy. In addition, this paper provides insight into the noise mechanism arising in multi-layered power distribution networks.