AN INTEGRATED, DIRECT-WRITE TEMPERATURE SHOCK RECORDING CHIP

被引：0

作者：

Shao, Zhichun ^{[1
]}

Liu, Huiliang ^{[1
,3
]}

Liu, Yumeng ^{[1
]}

Jang, Hyung-seok ^{[1
]}

Liu, Benyuanyi ^{[2
]}

Zhao, Bo ^{[2
]}

Niknejad, Ali M. ^{[2
]}

Lin, Liwei ^{[1
,3
]}

机构：

[1] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA

[2] Univ Calif Berkeley, Berkeley Wireless Res Ctr, Berkeley, CA 94720 USA

[3] Tsinghua Berkeley Shenzhen Inst, Shenzhen, Peoples R China

来源：

2018 IEEE MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) | 2018年

关键词：

FIBER SENSOR;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We have successfully demonstrated an on-chip, passive temperature shock recording chip to memorize temperature events in its electrical resistance with ultrahigh sensitivity 4 orders of sheet resistance drop within 2 minutes of a temperature shock. Compared with the state-of-art technologies, three distinctive advancements have been achieved: (1) the smallest size (400x450 mu m(2)) of its kind with integrated passive temperature sensor and circuitry; (2) passive temperature sensing based on the heating-induced reduction of silver-ions in a polymer film; and (3) the direct-write integration of the sensor strip onto an IC chip by the electrohydrodynamic printing process. As such, the proposed sensing scheme and results could open up a new class of passive temperature sensing to record heating events with wireless readouts.

引用

页码：507 / 510

页数：4

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