A system-of-systems based equipment for thermo-mechanical testing of advanced high power modules

被引：0
|
作者：
Famoso, Carlo [1 ]
Di Guardo, Mario [2 ]
Fortuna, Luigi [1 ]
Frasca, Mattia [1 ]
Graziani, Salvatore [1 ]
Testa, Natale [2 ]
机构：
[1] Univ Catania, DIEEI, I-95124 Catania, Italy
[2] STMicroelectronics Srl, Catania, Italy
来源：
2015 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS) | 2015年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The integration in small packages of high power modules requires in the phase of prototype testing integrated measurements and advanced software tools to assure high level reliability of the devices. In this paper a new integrated equipment based on the concept of system-of-systems is proposed. The system-of-systems equipment is intended as a platform including several measurement instrumentations, the power supply, the control boards and the testing modules, that themselves are complex systems.
引用
收藏
页码：197 / 200
页数：4
相关论文
共 50 条
  • [1] Remote Diagnostic Systems for Assessment of Thermo-mechanical Equipment of Power Plants
    Trzeszczynski, Jerzy
    [J]. CREEP & FRACTURE IN HIGH TEMPERATURE COMPONENTS: DESIGN & LIFE ASSESSMENT ISSUES, PROCEEDINGS, 2009, : 446 - 452
  • [2] Thermo-mechanical simulation of wire, bonding joints in power modules
    Ramminger, S
    Mitic, G
    Türkes, P
    Wachutka, G
    [J]. 1999 INTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, 1999, : 483 - 486
  • [3] Thermo-Mechanical Modelling and Design of SiGe-based Thermo-Electric Modules for High Temperature Applications
    Edwards, Michael
    Brinkfeldt, Klas
    [J]. 2013 14TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2013,
  • [4] Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes
    Medjahed, Hassen
    Vidal, Paul-Etienne
    Nogarede, Bertrand
    [J]. MICROELECTRONICS RELIABILITY, 2012, 52 (06) : 1099 - 1104
  • [5] Analyses of Thermo-Mechanical Reliability Issues for Power Modules Designed in Planar Technology
    Dudek, Rainer
    Doering, Ralf
    Hildebrandt, Marcus
    Rzepka, Sven
    Stegmeier, Stefan
    Kiefl, Stefan
    Sommer, Volkmar
    Mitic, Gerhard
    Weidner, Karl
    [J]. 2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2016,
  • [6] Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance
    Xu, Ling
    Liu, Yong
    Liu, Sheng
    [J]. MICROELECTRONICS RELIABILITY, 2014, 54 (12) : 2824 - 2835
  • [7] Thermo-Mechanical Simulations of SiC Power Modules with Single and Double Sided Cooling
    Brinkfeldt, Klas
    Edwards, Michael
    Ottosson, Jonas
    Neumaier, Klaus
    Zschieschang, Olaf
    Otto, Alexander
    Kaulfersch, Eberhard
    Andersson, Oag
    [J]. 2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2015,
  • [8] Thermo-mechanical virtual prototyping of laminate-based RF system-in-package modules
    Yang, D. G.
    van Driel, W. D.
    van den Boomen, R. W. J.
    Meeuwsen, F.
    [J]. ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 41 - +
  • [9] Thermo-mechanical analysis of advanced electronic packages in early system design
    Sommer, JP
    Wittler, O
    Manessis, D
    Michel, B
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2005, 12 (1-2): : 75 - 81
  • [10] Thermo-mechanical analysis of advanced electronic packages in early system design
    Johann-Peter Sommer
    Olaf Wittler
    Dionysios Manessis
    Bernd Michel
    [J]. Microsystem Technologies, 2005, 12 : 75 - 81
12345