Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module

被引:39
|
作者
Jeong, Min Woo [1 ]
Jeon, Seung Won [1 ]
Kim, Yongchan [1 ]
机构
[1] Korea Univ, Dept Mech Engn, Seoul 136701, South Korea
基金
新加坡国家研究基金会;
关键词
Light emitting diode (LED); Fin heat sink; Opening; Thermal design optimization; Natural convection; ENHANCEMENT; DISSIPATION; OPTIMIZATION; PERFORMANCE; CHIP;
D O I
10.1016/j.applthermaleng.2015.08.001
中图分类号
O414.1 [热力学];
学科分类号
摘要
Effective cooling is very important issue in a light emitting diode (LED) module because its performance and reliability decrease significantly as the junction temperature increases. This study proposes a cooling method that improves upon the poor ventilation and heat dissipation of a horizontal fin heat sink mounted on an LED module with natural convection. Response surface methodology (RSM) was used to optimize the geometry of the horizontal fin heat sink with the modified openings, and the cooling performance of the proposed model was compared against those of conventional fin heat sinks. The total thermal resistance of the proposed model is decreased by 30.5% relative to that of the conventional no-opening model at an orientation of 1800 and a heat input of 10 W. In addition, the luminous efficacy of the proposed model is increased by 23.7% relative to that of the conventional no-opening model at an orientation of 1800 and a heat input of 25 W. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:105 / 115
页数:11
相关论文
共 50 条
  • [21] Dynamic simulation, optimal design and control of pin-fin heat sink processes
    Chen, Chyi-Tsong
    Jan, Shi-Hung
    JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS, 2012, 43 (01) : 77 - 88
  • [22] A natural convection horizontal straight-fin heat sink design problem to enhance heat dissipation performance
    Huang, Cheng-Hung
    Chen, Wei-Yu
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2022, 176
  • [23] A design problem to estimate the optimal fin shape of LED lighting heat sinks
    Huang, Cheng-Hung
    Wang, Guan-Jie
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2017, 106 : 1205 - 1217
  • [24] Optimal design for thermal performance of a heat sink integrated with thermoelectric cooler
    Wu, M. C.
    Peng, C. H.
    Lee, C. Y.
    Fang, C. J.
    Hung, Y. H.
    HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4, 2005, : 519 - 526
  • [25] Analysis model for thermal resistance of double-sided cooling power module with pin-fin heat sink used in xEVs
    Cho, Seongmoo
    Yoon, Sang Won
    JOURNAL OF POWER ELECTRONICS, 2023, 23 (12) : 1880 - 1887
  • [26] Optimal Design of a microchannel heat sink with a pin-fin array integrated with Si interposer
    Sun, Yunna
    Kang, Taegyu
    Li, Jian
    Jin, Zhiyu
    Chang, Xinyue
    Wang, Yan
    Yang, Zhuoqing
    Wang, Guilian
    Ding, Guifu
    2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017,
  • [27] Optimal design on irregular polygon topology for the manifold micro-pin-fin heat sink
    Shi, Qianlei
    Liu, Qian
    Yao, Xiaole
    Sun, Chen
    Ju, Xing
    Abd El-Samie, Mostafa M.
    Xu, Chao
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2023, 141
  • [28] Thermal optimal design for heat sinks or heat sink/TEC assemblies in a ducted flow
    Wu, T. Y.
    Wu, M. C.
    Homg, J. T.
    Chang, S. F.
    Chen, P. L.
    Hung, Y. H.
    IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, : 213 - 220
  • [29] Thermal reliability-based design optimization using Kriging model of PCM based pin fin heat sink
    Dammak, Khalil
    El Hami, Abdelkhalak
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2021, 166
  • [30] Effects of fin positioning on the thermal performance of a phase change material-filled heat sink with horizontal fins
    Kim, Se Hyun
    Park, Seong Hyun
    Pandey, Sudhanshu
    Ha, Man Yeong
    JOURNAL OF ENERGY STORAGE, 2023, 68