PCB parameter extraction for signal integrity modeling

被引:1
|
作者
Hu, Kaisheng [1 ]
机构
[1] Ciena, Signal & Power Integr, Ottawa, ON, Canada
关键词
PCB; Relative Permittivity; Loss Tangent; surface roughness; stripline; de-embedding;
D O I
10.1109/EMCSI39492.2022.9889355
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
PCB material parameters (Dk, Df and surface roughness) are key factors for signal integrity analysis. By using the parameters within vendor's datasheets directly, simulation result always have big offset compared with lab measurement result due to different production variations. To improve the accuracy of simulation and guarantee a design to be successful for the first-time, one test coupon board is designed, fabricated, and measured. PCB laminate parameters are extracted based on lab measurements instead of datasheet values. With the extracted parameters and same stack up under same factory production process, high-speed channel simulation can predict transmission line & RF transition's performance on real PCB products with reliable simulation accuracy up to 50 GHz.
引用
收藏
页码:93 / 96
页数:4
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