The mechanical behavior of interconnect materials for electronic packaging

被引：81
|
作者：
Frear, DR
机构：
[1] University of California, Berkeley, CA
[2] Sandia National Laboratories, M.S. 1411, Albuquerque, NM 87185
来源：
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1996年 / 48卷 / 05期
关键词：
D O I：
10.1007/BF03222944
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A variety of new materials are needed for solder interconnects in electronic packages for high- and low-temperature applications. This article compares the mechanical behavior of low-temperature materials (Sn-40In-20Pb, Sn-58Bi, and a silver-loaded conductive adhesive) and high-melting-temperature solders (Sn-3.5Ag, Sn-3.4Ag-4.8Bi, and Sn-4.7Ag-1.7 Cu) to near-eutectic Sn-40Pb solder. The results indicate that there are promising materials alternatives to the traditional Sn-Pb solders in electronic interconnect applications.
引用
收藏
页码：49 / 53
页数：5
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