Thermal interface material resistance measurement apparatus

被引：0
|
作者：
Badoni, Stuti Shekher [1 ]
Rhee, Jinny [1 ]
机构：
[1] San Jose State Univ, 1 Washington Sq, San Jose, CA 95192 USA
来源：
IEEE CPMT: INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES | 2006年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：157 / 157
页数：1
相关论文
共 50 条
  • [21] A testing apparatus for thermal interface materials
    Aoki, R
    Chiu, CP
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 1036 - 1041
  • [22] Reducing thermal contact resistance using a bilayer aligned CNT thermal interface material
    Wang, H.
    Feng, J. Y.
    Hu, X. J.
    Ng, K. M.
    CHEMICAL ENGINEERING SCIENCE, 2010, 65 (03) : 1101 - 1108
  • [23] Study on thermal contact resistance of low melting alloy used as thermal interface material
    Swamy, Mc Kumar
    Satyanarayan
    Pinto, Richard
    MATERIALS TODAY-PROCEEDINGS, 2022, 66 : 2508 - 2512
  • [24] Experimental investigation of high temperature thermal contact resistance with interface material
    Xiaoping Zheng1
    Theoretical & Applied Mechanics Letters, 2011, 1 (05) : 41 - 44
  • [25] Experimental investigation of high temperature thermal contact resistance with interface material
    Zheng, Xiaoping
    Liu, Donghuan
    Wei, Dong
    Shang, Xinchun
    THEORETICAL AND APPLIED MECHANICS LETTERS, 2011, 1 (05)
  • [26] Effect of interface thermal resistance on ignition of reactive material by a hot particle
    Yang, Jiuling
    Wang, Supan
    Chen, Haixiang
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2016, 97 : 146 - 156
  • [27] Design of a high reliability and low thermal resistance interface material for microelectronics
    Gowda, A
    Zhong, A
    Esler, D
    David, J
    Tonapi, S
    Srihari, K
    Schattenmann, F
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 557 - 562
  • [28] Measurement and evaluation for interface thermal resistance of metal-dielectric layers
    Chien, H. C.
    Yao, D. J.
    MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2008, : 451 - +
  • [29] Advanced Measurement Method for Thermal Interface Material Thickness of Flip Chip Package
    Chang, Shih-Ping
    Chen, Liang-Pin
    2021 16TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2021, : 235 - 236
  • [30] APPARATUS FOR MEASUREMENT OF THERMAL EMF IN SEMICONDUCTORS
    BRICE, JC
    WRIGHT, HC
    JOURNAL OF SCIENTIFIC INSTRUMENTS, 1958, 35 (04): : 146 - 147
12345