Full Low Temperature Solder BGA Development for Large size BGA Package

被引：5

作者：

Koide, Masateru ^{[1
]}

Fukuzono, Kenji ^{[2
]}

Watanabe, Manabu ^{[2
]}

Yamamoto, Tsuyoshi ^{[2
]}

Sakuyama, Seiki ^{[3
]}

机构：

[1] Fujitsu Adv Technol Ltd, Business Planning Romot Off, Kawasaki, Kanagawa, Japan

[2] Fujitsu Adv Technol Ltd, Packaging Technol Dept, Kawasaki, Kanagawa, Japan

[3] Fujitsu Ltd, Serv Platform Business Grp, Platform Dev Unit, Kawasaki, Kanagawa, Japan

来源：

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) | 2020年

关键词：

Low melting point solder; SnBiAg; BGA;

D O I：

10.1109/ECTC32862.2020.00201

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Fujitsu Limited (Fujitsu) has been adopting various compositive solders in developments of CPU packages used for high performance computers since 1990's. At first, SnPb solders were used in an age of MCM, while switched to SnAg and SnBiAg later for improving their manufacturability. After that, in the age of SCM, though SAC solders were used at the beginning, corresponding to tremendously increased performance as well as power consumption, size of the CPU packages are becoming larger year by year, in according some serious issues must be evaluated and worked out comprehensively. Regarding to the issues of BGA mounting yields due to their thermal warpage behaviors, managements of thermal resistance and temperatures, and failures of the 1st level connections, innovative manufacturing processes and mounting structures of all low-temperature solders are improved with applying SnBiAg for all BGA and pre-solders, the featured SPARC64 (TM) XIfx packages were confirmed and shipped from 2014.

引用

页码：1265 / 1269

页数：5

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