Experiments on the bonding interface vibration of thermosonic flip chip

被引：0
|
作者：
Wang Fu-liang [1 ]
Han Lei [1 ]
Zhong Jue [1 ]
机构：
[1] Cent S Univ, Coll Mech & Elect Engn, Changsha 410083, Peoples R China
来源：
PROCEEDINGS OF THE SEVENTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN, PACKAGING AND FAILURE ANALYSIS (HDP'05) | 2005年
关键词：
thermosonic flip chip; bonding interface; relatively vibration;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The vibration of chip and tool tip during thermosonic flip chip donding were studied. By measure the vibration of the chip and tool tip with a doppler laser vibration measure system, the "suddenly velocity decrease" of chip was elucited. It is noticed that this means the bonding stregnth formed in the bonding interface. By analyzing the vibration displacement and frequency of the chip and comparing with the vibration displacement of the tool tip, it is noticed that the chip vibrates in a "stick-slip" state after the "suddenly velocity decrease", and the continued ultrasonic vibration may effect the formed bonding area, and suggest about the ultrasonic power supply pattern was obtained.
引用
收藏
页码：33 / 35
页数：3
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