Micromechanisms of delamination failure in RTM U-beams

被引:1
|
作者
Holmberg, JA [1 ]
Berglund, LA [1 ]
机构
[1] LULEA UNIV TECHNOL,DIV POLYMER ENGN,S-97187 LULEA,SWEDEN
关键词
resin transfer moulding; U-beam; plain weave; voids; microscopy; failure mechanisms;
D O I
10.1016/S1359-835X(97)00014-6
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In a previous study, resin transfer moulded U-beams were subjected to opening tensile loads applied to the flanges. The failure behaviour was sensitive to the void content of the material. In the present study, we use optical microscopy of polished edges to observe mechanisms of failure in-situ as delaminations develop in the beam radius. Descriptions of these failure mechanisms are presented. Voids were found to facilitate the growth phase of the delamination process in the beam radius. The mechanisms described will be used in a forthcoming stress analysis to explain the experimentally observed failure behaviour of beams with different radii and void contents. (C) 1997 Elsevier Science Limited.
引用
收藏
页码:709 / 717
页数:9
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