PMMA microfluidic chip fabrication using laser ablation and low temperature bonding with OCA film and LOCA

被引：29
|
作者：
Liu, Kan [1 ,2 ,3 ]
Xiang, Jianzhen [1 ,2 ,3 ]
Ai, Zhao [1 ,2 ,3 ]
Zhang, Shoukun [1 ,2 ,3 ]
Fang, Yi [1 ,2 ,3 ]
Chen, Ting [1 ,2 ,3 ]
Zhou, Qiongwei [1 ,2 ,3 ]
Li, Songzhan [1 ,2 ,3 ]
Wang, Shengxiang [1 ,2 ,3 ]
Zhang, Nangang [1 ,2 ,3 ]
机构：
[1] Wuhan Text Univ, Coll Elect & Elect Engn, Text Ind Chain Collaborat Gener Technol Innovat C, Wuhan 430200, Hubei, Peoples R China
[2] Wuhan Text Univ, Text Mat & Adv Proc Technol Hubei Prov, Wuhan 430200, Hubei, Peoples R China
[3] Wuhan Text Univ, Minist State Key Lab Breeding Base, Wuhan 430200, Hubei, Peoples R China
来源：
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2017年 / 23卷 / 06期
基金：
中国国家自然科学基金;
关键词：
EXCIMER-LASER; POLYMER;
D O I：
10.1007/s00542-016-2924-1
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new PMMA microfluidic chip fabrication method by combining laser ablation technology with low-temperature bonding using optically clear adhesive (OCA) film and liquid optically clear adhesive (LOCA) was presented in this paper. The deformation and clogging issues of the microfluidic channel were well solved. The effective bonding area ratio of microfluidic chips could be greatly improved by adjusting bonding temperature and bonding time. The crevices around the microchannels were effectively eliminated by coating treatment of LOCA. The bonding strength and waterproof of PMMA microfluidic chips coating with/without LOCA were also evaluated in this paper.
引用
收藏
页码：1937 / 1942
页数：6
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