Non-uniform residual stresses for parallel assembly of out-of-plane surface-micromachined structures

被引：12
|
作者：
Johnstone, R. W. [1 ]
Sameoto, D. [1 ]
Parameswaran, M. [1 ]
机构：
[1] Simon Fraser Univ, Inst Micromachine & Microfabricat, Burnaby, BC V5A 1S6, Canada
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2006年 / 16卷 / 11期
关键词：
D O I：
10.1088/0960-1317/16/11/N01
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This note describes a method for the parallel self-assembly of out-of-plane surface-micromachined structures that uses non-uniform residual stresses, inherent in many surface-micromachining processes. The residual stresses are used to achieve a one-time only actuation capable of lifting and assembling raised structures. Theory is provided to calculate the deflection and stiffness of bi-layer cantilevers. Devices for amplifying the vertical deflection are demonstrated and used to assemble large arrays of devices.
引用
收藏
页码：N17 / N22
页数：6
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