Non-uniform residual stresses for parallel assembly of out-of-plane surface-micromachined structures

被引：12

作者：

Johnstone, R. W. ^{[1
]}

Sameoto, D. ^{[1
]}

Parameswaran, M. ^{[1
]}

机构：

[1] Simon Fraser Univ, Inst Micromachine & Microfabricat, Burnaby, BC V5A 1S6, Canada

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2006年 / 16卷 / 11期

关键词：

D O I：

10.1088/0960-1317/16/11/N01

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This note describes a method for the parallel self-assembly of out-of-plane surface-micromachined structures that uses non-uniform residual stresses, inherent in many surface-micromachining processes. The residual stresses are used to achieve a one-time only actuation capable of lifting and assembling raised structures. Theory is provided to calculate the deflection and stiffness of bi-layer cantilevers. Devices for amplifying the vertical deflection are demonstrated and used to assemble large arrays of devices.

引用

页码：N17 / N22

页数：6

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