Dynamic recrystallization at triple junction during high-temperature deformation in copper tricrystal

被引：6

作者：

Andiarwanto, S ^{[1
]}

Miura, H ^{[1
]}

Sakai, T ^{[1
]}

机构：

[1] Univ Electrocommun, Dept Mech Engn & Intelligent Syst, Chofu, Tokyo 1828585, Japan

来源：

TEXTURES OF MATERIALS, PTS 1 AND 2 | 2002年 / 408-4卷

关键词：

copper; dynamic recrystallization; high temperature; tensile deformation; tricrystal; triple junctions;

D O I：

10.4028/www.scientific.net/MSF.408-412.761

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Dynamic recrystallization (DRX) at triple junction in copper tricrystal was investigated during high-temperature tensile deformation. DRX nucleation occurred preferentially at triple junction at lower strain than the peak strain (about 2/3). Preferential occurrence of DRX nucleation at triple junction is considered as a result of stress and deformation concentration. Most of DRX grains were twin. DRX nucleation process at the triple function was discussed in relation to grain-boundary sliding, fold formation and grain-boundary migration.

引用

页码：761 / 766

页数：6

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