Nanostructure formation at tile solid/liquid interface

被引：8

作者：

Kolb, D. M. ^{[1
]}

Simeone, F. C. ^{[1
]}

机构：

[1] Univ Ulm, Dept Electrochem, D-89069 Ulm, Germany

来源：

CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE | 2005年 / 9卷 / 1-2期

关键词：

copper; electrochemistry; metal clusters; nanostructuring; palladium; scanning tunneling microscopy;

D O I：

10.1016/j.cossms.2006.02.015

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electrochemical processes are widely recognized as a versatile, yet simple strategy for nanostructuring solid surfaces, which complements commonly employed techniques in UHV. In recent years, in situ scanning tunneling microscopy (STM) has taken the lead in exploring possible routes to nanostructure fabrication at solid/liquid interfaces. A brief survey is presented of currently used methods for an electrochemical nanostructuring with an STM. (c) 2006 Elsevier Ltd. All rights reserved.

引用

页码：91 / 97

页数：7

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