Cooling and packaging of RF components

被引：0
|
作者：
Ter Brake, HJM [1 ]
机构：
[1] Univ Twente, Fac Appl Phys, NL-7500 AE Enschede, Netherlands
来源：
MICROWAVE SUPERCONDUCTIVITY | 2001年 / 375卷
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：271 / 304
页数：34
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