Thermodynamic properties of liquid Al-Sn-Zn alloys: A possible new lead-free solder material

被引：24
|
作者：
Knott, S [1 ]
Mikula, A [1 ]
机构：
[1] Univ Vienna, Inst Anorgan Chem, A-1090 Vienna, Austria
来源：
MATERIALS TRANSACTIONS | 2002年 / 43卷 / 08期
关键词：
aluminum-tin-zinc ternary system; thermodynamic properties; lead-free solder materials; electromotive force measurements;
D O I：
10.2320/matertrans.43.1868
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Because of its potential to be used as a lead free solder material the thermodynamic properties of the liquid Al-Sn-Zn system were investigated. Using an appropriate galvanic cell, the partial free energies of Al were determined as a function of concentration and temperature. Thermodynamic properties were obtained for 30 alloys. Their composition was situated on three cross-sections with constant ratios of Sn:Zn 2: 1, 1:1 and 1:2. The integral Gibbs energy and the integral enthalpy for the ternary system at 973 K were calculated by Gibbs-Duhem integration.
引用
收藏
页码：1868 / 1872
页数：5
相关论文
共 50 条
  • [21] Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
    Osorio, Wislei R.
    Peixoto, Leandro C.
    Garcia, Leonardo R.
    Mangelinck-Noel, Nathalie
    Garcia, Amauri
    JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 572 : 97 - 106
  • [22] Properties of new gold based multicomponent alloys as innovative lead-free solder material
    Gomidzelovic, L.
    Zivkovic, D.
    Talijan, N.
    Cosovic, V.
    MATERIALS RESEARCH INNOVATIONS, 2015, 19 (02) : 145 - 149
  • [23] Study of new types lead-free solder alloys of Sn-Ag-Cu-Al-Ni and Sn-Zn-Bi-In-P
    Ma, Jusheng
    Chen, Guohai
    Li, Xiaoyan
    Tanaka, Takeshi
    Tang, Jie
    ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 251 - +
  • [24] Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
    Osório, W.R. (wislei.osorio@fca.unicamp.br), 1600, Elsevier Ltd (572):
  • [25] Thermal properties and phase stability of Zn-Sn and Zn-In alloys as high temperature lead-free solder
    Lee, Jae-Ean
    Kim, Keun-Soo
    Suganuma, Katsuaki
    Inoue, Masahiro
    Izuta, Goro
    MATERIALS TRANSACTIONS, 2007, 48 (03) : 584 - 593
  • [26] Surface segregation and surface tension in Al-Sn-Zn liquid alloys
    Prasad, LC
    Mikula, A
    PHYSICA B-CONDENSED MATTER, 2006, 373 (01) : 142 - 149
  • [27] Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys
    Yavuzer, B.
    Ozyurek, D.
    Tuncay, T.
    MATERIALS SCIENCE-POLAND, 2020, 38 (01): : 34 - 40
  • [28] Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder
    Islam, RA
    Wu, BY
    Alam, MO
    Chan, YC
    Jillek, W
    JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 392 (1-2) : 149 - 158
  • [29] Solidification behavior of Sn-9Zn-xAg lead-free solder alloys
    Tsai, YL
    Hwang, WS
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 413 : 312 - 316
  • [30] Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
    C. M. L. Wu
    D. Q. Yu
    C. M. T. Law
    L. Wang
    Journal of Electronic Materials, 2002, 31 : 928 - 932
12345