Simulation of bulk piezoelectric implant with amplitude modulation-based backscatter communication for implant applications

被引:0
|
作者
Akhtar, Muhammad Junaid [1 ]
Toymus, Alp Timucin [2 ]
Beker, Levent [2 ]
机构
[1] Koc Univ, Elect & Elect Engn, Istanbul, Turkey
[2] Koc Univ, Mech Engn, Istanbul, Turkey
关键词
Implants; Acoustics; Backscatter; Circuit model; Echo modulation; Piezoelectric; Ultrasound; EQUIVALENT-CIRCUITS;
D O I
10.1109/IUS52206.2021.9593728
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
Recently, ultrasound has been used for power transfer and backward data transmission from implantable medical devices. Backward data communication is typically based on the amplitude modulation of the backscattered signal with changing electrical load of the implant. Contrary to its importance, the sensitivity of the backscattered voltage with reference to the electrical load has not been quantitatively determined yet. This work presents the results of transient simulations and shows the increasing trend in echo voltage with the increasing load resistance. Additionally, simulation studies indicate a decreasing sensitivity of echo voltage to load resistance with increasing backing impedance of the implant.
引用
收藏
页数:3
相关论文
共 50 条
  • [31] Multi-channel thin film piezoelectric acoustic transducer for cochlear implant applications
    Yuksel, Muhammed Berat
    Ilik, Bedirhan
    Koyuncuoglu, Aziz
    Kulah, Haluk
    [J]. 2019 IEEE SENSORS, 2019,
  • [32] FM Rider: Two-FSK Modulation-Based Ambient FM Backscatter Over 100 m Distance
    Xu, Kai
    Gong, Wei
    Li, Yuepei
    Purushothama, Jayakrishnan Methapettyparambu
    Goussetis, George
    McLaughlin, Stephen
    Thompson, John S.
    Song, Chaoyun
    Ding, Yuan
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2024, 72 (09) : 5563 - 5575
  • [33] Power and signal dual modulation-based bidirectional communication between intrinsically safe converters
    Wang, Tan
    Yu, Dongsheng
    Tang, Xudong
    Yu, Samson S.
    Hu, Yihua
    [J]. IET POWER ELECTRONICS, 2024, 17 (02) : 266 - 280
  • [34] Mandarin tone recognition training with cochlear implant simulation: Amplitude envelope enhancement and cue weighting
    Kim, Seeon
    Chou, Hsiao-Hsiuan
    Luo, Xin
    [J]. JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 2021, 150 (02): : 1218 - 1230
  • [35] Amplitude Modulation-based Electrical Stimulation for Encoding Multipixel Spatiotemporal Visual Information in Retinal Neural Activities
    Ryu, Sang Baek
    Choi, Jeong Woo
    Ahn, Kun No
    Goo, Yong Sook
    Kim, Kyung Hwan
    [J]. JOURNAL OF KOREAN MEDICAL SCIENCE, 2017, 32 (06) : 900 - 907
  • [36] Novel Ti-based bulk metallic glass free of toxic and noble elements for bio-implant applications
    Du, Peng
    Li, Bohua
    Chen, Jie
    Li, Kun
    Xie, Guoqiang
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 934
  • [37] Simulation and Measurement Data-Based Study on Fat as Propagation Medium in WBAN Abdominal Implant Communication Systems
    Sarestoniemi, Mariella
    Pomalaza-Raez, Carlos
    Kissi, Chaimaa
    Iinatti, Jari
    [J]. IEEE ACCESS, 2021, 9 : 46240 - 46259
  • [38] Characterization of pulse amplitude and pulse rate modulation for a human vestibular implant during acute electrical stimulation
    Nguyen, T. A. K.
    DiGiovanna, J.
    Cavuscens, S.
    Ranieri, M.
    Guinand, N.
    van de Berg, R.
    Carpaneto, J.
    Kingma, H.
    Guyot, J-P
    Micera, S.
    Fornos, A. Perez
    [J]. JOURNAL OF NEURAL ENGINEERING, 2016, 13 (04)
  • [39] Phase-Coded Modulation-Based Time-of-Flight Measurement Improvement for Piezoelectric Ceramic Transducers
    Dycka, Pavel
    Janu, Premysl
    Bajer, Josef
    Bystricky, Radek
    [J]. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2021, 68 (04) : 1362 - 1369
  • [40] Electrospinning of polyisobutylene-based thermoplastic elastomer for implant applications
    Jindal, Aditya
    Charif, Andrea
    McClain, Andrew-David
    Paiva, Bruno
    Camassola, Melissa
    Puskas, Judit
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2016, 252