Effect of technological voids on swelling behaviour of compacted bentonite-claystone mixture

被引:19
|
作者
Zeng, Zhixiong [1 ]
Cui, Yu-Jun [1 ]
Zhang, Feng [1 ]
Conil, Nathalie [2 ]
Talandier, Jean [2 ]
机构
[1] Ecole Ponts ParisTech, Lab Navier, CERMES, 6&8 Ave Blaise Pascal, F-77455 Marne La Vallee 2, France
[2] Andra, Ctr Meuse Haute Marne, RD 960, F-55290 Bure, France
关键词
bentonite-claystone mixture; technological voids; swelling pressure; swelling anisotropy; microstructure; HYDROMECHANICAL BEHAVIOR; MICROSTRUCTURE; CONDUCTIVITY; MX-80; CLAY;
D O I
10.1139/cgj-2019-0339
中图分类号
P5 [地质学];
学科分类号
0709 ; 081803 ;
摘要
The effect of technological voids on the swelling pressure of compacted MX80 bentonite-Callovo-Oxfordian (COx) claystone mixture was investigated by simulating the technological voids with a pre-defined space between the compacted disks of the mixture. Both axial and radial swelling pressures were monitored. After the tests, the microstructure of samples at different positions was investigated using mercury intrusion porosimetry (MIP), together with the determination of dry density and water content. Results showed that two main processes, filling and homogenization, occurred during soil hydration. In the filling process, the initial technological voids were gradually filled and the axial swelling pressure tended to increase. In the homogenization process, the samples had a sealing zone and a swelling zone. The sealing zone was characterized by a lower dry density than the expected final dry density while the swelling zone was characterized by a larger one. From the MIP results, the sealing zone showed larger inaccessible-pore, medium-pore, and large-pore void ratios and a lower small-pore void ratio than the swelling zone. Over time, the medium and large pores in the sealing zone were compressed, while the small pores in the swelling zone decreased. The stabilized axial swelling pressure followed a unique relationship with the expected final dry density. Moreover, the swelling pressure anisotropy was found to decrease as the technological voids increased.
引用
收藏
页码:1881 / 1892
页数:12
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