Structure, morphology, and composition of nanometric Pd films deposited by dc magnetron sputtering on Cu, Ag, and Au foils

被引:4
|
作者
Nascente, P. A. P.
Maluf, S. S.
Pinheiro, L. M. P.
Gobbi, A. L.
Paulin-Filho, P. I.
Fantini, M. C. A.
Alcantara, N. G.
机构
[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP, Brazil
[2] Rhodia Engn Plast S Amer, BR-09842080 Sao Bernardo do Campo, SP, Brazil
[3] Lab Nacl Luz Sincrotron, BR-13083100 Campinas, SP, Brazil
[4] Univ Sao Paulo, Inst Fis, BR-05508900 Sao Paulo, Brazil
基金
巴西圣保罗研究基金会;
关键词
thin films; palladium; copper; gold; silver; XPS; AFM;
D O I
10.1016/j.msea.2006.06.045
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The comprehension of atomic and electronic structures of bimetallic systems is important in several areas, such as catalysis, sensors, and microelectronics. The aim of this study is to investigate thin (10 nm) films of palladium deposited on polycrystalline copper, silver, and gold foils by dc magnetron sputtering. We employed atomic force microscopy (AFM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) in order to characterize the morphology, structure, and surface composition of the films. AFM images revealed that the surfaces of Cu and, in a smaller degree, Ag foils were covered with small grains (particles). XPS results indicated that these particles were oxidized copper and silver. Gold substrate presented a flat morphology, with no detectable oxide formation. Pd films covered the small particles for both Cu and Ag substrates, presenting a flat morphology. In the case of Pd film deposited on Au, the morphology was similar to the substrate. For all three cases, XPS results indicated that Pd is mainly in the metallic state. XRD results showed the presence of a polycrystalline Pd film on top of Cu foil, but not for either Ag or An foils. (c) 2006 Elsevier B.V.. All rights reserved.
引用
收藏
页码:303 / 307
页数:5
相关论文
共 50 条
  • [41] Characteristics of triode magnetron sputtering: the morphology of deposited titanium films
    Fontana, LC
    Muzart, JLR
    SURFACE & COATINGS TECHNOLOGY, 1998, 107 (01): : 24 - 30
  • [42] Morphology of novel antimicrobial silver films deposited by magnetron sputtering
    Sant, SB
    Gill, KS
    Burrell, RE
    SCRIPTA MATERIALIA, 1999, 41 (12) : 1333 - 1339
  • [43] Development and characterization of TiAlN (Ag, Cu) nanocomposite coatings deposited by DC magnetron sputtering for tribological applications
    Mejia V, Hernan D.
    Perea, D.
    Bejarano G, Gilberto
    SURFACE & COATINGS TECHNOLOGY, 2020, 381
  • [44] Optical and electrical properties of ITO/Ag/lTO multilayer thin films deposited by DC magnetron sputtering
    Choi, Yong-Lak
    Kim, Seon-Hwa
    ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2, 2007, 124-126 : 403 - +
  • [45] Chemical Composition and Structure–Vacancy Disordering in Ag–Au, Cu–Au, Ag–Pd, and Cu–Pd Alloys as Factors of Their Electrocatalytic Activity
    A. V. Vvedenskii
    N. B. Morozova
    G. E. Shcheblykina
    Russian Journal of Electrochemistry, 2002, 38 : 389 - 397
  • [46] Structure of AlN films deposited by magnetron sputtering method
    Nowakowska-Langier, K.
    Chodun, R.
    Zdunek, K.
    Minikayev, R.
    Nietubyc, R.
    MATERIALS SCIENCE-POLAND, 2015, 33 (03): : 639 - 643
  • [47] Structure of Multilayer ZnO Films Deposited by a Magnetron Sputtering
    Ievtushenko, A. I.
    Karpyna, V. A.
    Lashkaryov, G. V.
    Lazorenko, V. J.
    Baturin, V. A.
    Karpenko, O. Yu.
    Lunika, M. M.
    Puzikov, V. M.
    METALLOFIZIKA I NOVEISHIE TEKHNOLOGII, 2008, 30 (11): : 1511 - 1519
  • [48] AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering for SAW applications
    Aissa, K. Ait
    Achour, A.
    Elmazria, O.
    Simon, Q.
    Elhosni, M.
    Boulet, P.
    Robert, S.
    Djouadi, M. A.
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2015, 48 (14)
  • [49] Surface morphology and dynamic scaling in growth of iron nitride thin films deposited by dc magnetron sputtering
    Wang, X
    Zheng, WT
    Gao, LJ
    Wei, L
    Guo, W
    Bai, YB
    Fei, WD
    Meng, SH
    He, XD
    Han, JC
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (04): : 983 - 987