Dip-coated multi-core (Bi,Pb)2 Sr2Ca2Cu3Ox tape process -: an alternative way of fabricating multi-core (Bi,Pb)2 Sr2Ca2Cu3Ox tape conductors

The dip-coating-then-stacking (DIS) process, which is simpler and easier than the oxide-powder-in-tube (OPIT) process, was developed to fabricate multi-core (Bi,Pb)(2)Sr2Ca2Cu3Ox conductors. In the DIS process, multi-core tapes were prepared by stacking several layers of single side dip-coated Ag strips then wrapping them with Ag foil. After burning at 500 degrees C to remove organic materials, tape samples were rolled to increase the packing density of oxide core, then were heat-treated twice at 838 degrees C in air with an intermediate pressing. There was no bubbling problem throughout the heat treatment and the interface between oxide core and Ag was very smooth. By the DIS process, transport critical current (I-c) similar to 73 A and transport critical current density (J(c)) similar to 17 600 A/cm(2) at 77 K, 0 T were so far obtained. Considering the easiness and simplicity of the DIS process relative to OPIT with reasonably high I-c and J(c) values so far obtained, it appears that the DIS process can be applied as an alternative way to OPIT for fabricating multi-core (Bi,Pb)(2)Sr2Ca2Cu3Ox tape conductors. (C) 2000 Elsevier Science B.V. All rights reserved.