Dynamic balance between grain refinement and grain growth during high-pressure torsion of Cu powders

被引:39
|
作者
Wen, Haiming [1 ]
Islamgaliev, Rinat K. [2 ]
Nesterov, Konstantin M. [2 ]
Valiev, Ruslan Z. [2 ]
Lavernia, Enrique J. [1 ]
机构
[1] Univ Calif Davis, Dept Chem Engn & Mat Sci, Davis, CA 95616 USA
[2] Ufa State Aviat Tech Univ, Inst Phys Adv Mat, Ufa 450000, Russia
基金
美国国家科学基金会;
关键词
high-pressure torsion; nanostructured materials; grain growth; grain refinement; deformation mechanism; dislocations; STACKING-FAULT ENERGY; MICROSTRUCTURAL EVOLUTION; DEFORMATION; TEMPERATURE; COPPER; PLASTICITY; EXTRUSION; ALLOYS;
D O I
10.1080/09500839.2013.805268
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
High-pressure torsion (HPT) was applied to unmilled coarse-grained (CG) Cu powders with low initial dislocation density and cryomilled nanocrystalline (nc) Cu powders with high initial dislocation density, with identical processing parameters. HPT of unmilled CG Cu powders resulted in exceptional grain refinement and increase in dislocation density, whereas significant grain growth and decrease in dislocation density occurred during HPT of cryomilled nc Cu powders. Equilibrium structures were achieved under both conditions, with very similar stable grain sizes and dislocation densities, suggesting dynamic balances between deformation-induced grain refinement and grain growth, and between deformation-induced dislocation accumulation and dislocation annihilation. The equilibrium structures are governed by these two dynamic balances.
引用
收藏
页码:481 / 489
页数:9
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