Advanced Process Control (APC) and Real Time Dispatch (RTD) system integration for Etch Depth Control process in 300mm Fab

被引：0
|
作者：
Agrawal, Gaurav K. [1 ]
Loh, Soon Yoong [1 ]
Shebi, Abemelek B. [2 ]
机构：
[1] GlobalFoundries, Malta, NY 12020 USA
[2] Final Phase Syst, Austin, TX 78741 USA
来源：
2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2015年
关键词：
APC; Etch; Run-to-Run; RTD; System Integration; 300mm Semiconductor Manufacturing; TO-RUN CONTROL; FEEDBACK-CONTROL; VIRTUAL METROLOGY; SEMICONDUCTOR;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Most commonly used feed forward and feedback threaded control algorithms are not always sufficed to achieve the expected process control results. New smaller node sizes and complex process control requirements demand for new and embedded solutions. This paper discusses an advanced integration approach where a complete automation solution was designed and implemented by integrating Real Time Dispatching (RTD) and Advanced Process Control (APC) systems, delivering to complex custom process control requirements for a critical Deep Trench (DT) Poly Stud Recess Etch.
引用
收藏
页码：390 / 394
页数：5
相关论文
共 50 条
  • [1] Advanced Process Control (APC) for Selective EPI process in 300mm Fab
    Peng, Hongying
    Caruso, Jonathan
    Manian, Dinesh Balasubra
    Chakravorty, Shiladitya
    Mickelson, Ryan
    Tay, Jensen
    Cabral, Stephen
    Lu, Lixin
    Gaire, Churamani
    Holt, Judson
    Braithwaite, Glyn
    Shao, Dali
    Tong, Wei Hua
    [J]. 2020 31ST ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2020,
  • [2] Test wafer control system in 300mm FAB
    Hsu, JW
    Lo, HL
    Pan, CC
    Chen, YM
    Hsieh, TK
    [J]. 2004 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP PROCEEDINGS, 2004, : 33 - 36
  • [3] Microeconomics of 300mm process module control
    Monahan, KM
    Chatterjee, A
    Falessi, G
    Levy, A
    Stoller, M
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XV, 2001, 4344 : 530 - 543
  • [4] Integration of lot dispatching and AMHS control in a 300mm wafer FAB
    Sun, DS
    Park, NS
    Lee, YJ
    Jang, YC
    Ahn, CS
    Lee, TE
    [J]. 2005 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP: ADVANCING SEMICONDUCTOR MANUFACTURING EXCELLENCE, 2005, : 270 - 274
  • [5] A Data Mining Technique for Real Time Process Monitoring with Mass Spectrometry APC : Advanced Process Control
    Park, Soyeon
    Lee, Sungbin
    Hong, Eunsun
    Kim, Bumsik
    Yi, Jihye
    Kim, Gyeom
    Kim, Jinho
    Park, Jungdae
    [J]. 2020 31ST ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2020,
  • [6] Keeping advanced process control (APC) performance and maintenance and improvement of APC system
    Yoneda, Minoru
    Nishizawa, Jun
    Ooyama, Stoshi
    Amano, Souichi
    Onodera, Kouichi
    Yano, Kunihisa
    [J]. 2006 SICE-ICASE INTERNATIONAL JOINT CONFERENCE, VOLS 1-13, 2006, : 5688 - +
  • [7] Real-time In-situ Plasma Etch Process Monitoring for Sensor Based-Advanced Process Control
    Ahn, Jong Hwan
    Gu, Ja Myong
    Han, Seung-Soo
    Hong, Sang Jeen
    [J]. JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, 2011, 11 (01) : 1 - 5
  • [8] Real time statistical process control for improved etch tool performances
    Smith, G
    Highberg, I
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (01): : 533 - 537
  • [9] TEM Sample Prep Tool Matching - DualBeam FIB Cut Look and Measure (CLM) Monitoring for Process Control and Development in a 300mm IC Fab
    Jeon, Jangbae
    [J]. ISTFA 2016: CONFERENCE PROCEEDINGS FROM THE 42ND INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2016, : 568 - 570
  • [10] Integration of real time quality control systems in a welding process
    NavaRudiger, E
    Houlot, M
    [J]. JOURNAL OF LASER APPLICATIONS, 1997, 9 (02) : 95 - 102
12345