Inter-Chip Wireless Communication

被引：0
|
作者：
Wu, Hsin-Ta
Lin, Jau-Jr
Kenneth, K. O.
机构：
来源：
2013 7TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP) | 2013年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The wireless channel characteristics for inter-chip communication at 15-24-GHz in a hybrid engine controller printed circuit board (PCB) with and without a metal cover are presented. The channels are characterized using a 3-mm on-chip dipole antenna pair. At 15-cm separation, by adding a metal cover similar to 3.5 cm above the PCB, the antenna pair gain can be improved by similar to 10 dB and the maximum excess delay can be reduced to similar to 1.1 ns from similar to 16.5 ns. A bond wire antenna has efficiency of similar to 15% at similar to 60 GHz and is sufficient for building a 1-Gbps radio link with a bit error rate of 10(-12) between chips separated by 10cm.
引用
收藏
页码：3647 / 3649
页数：3
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