HFSS simulation of wireless inter-chip communication for 5G applications

被引：0

作者：

Long, Yu-Hao ^{[1
]}

Yu, Jhih-Yu ^{[1
]}

Pan, Chung-Long ^{[1
]}

Huang, Yu-Jung ^{[1
]}

机构：

[1] I Shou Univ, Dept Elect Engn, 1,Sec 1,Syuecheng Rd, Kaohsiung 84001, Taiwan

来源：

2018 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP) | 2018年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The signal transmission effect of the three-dimensional stacked die with capacitive coupling interconnection is analyzed in this paper. The results of the HFSS simulation show that the differential signaling quality depends on the size of the signal pad and the pad pitch. The 3D pad placement design methodology can he applied to expedite the optimized implementation of a stacked die structure. This is very important for the Fifth Generation (5G) of mobile network communication technology applications.

引用

页数：2

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