Three-Dimensional microfabrication of copper column by localized electrochemical deposition

Micrometer copper columns were fabricated by a rising technology applied for fabricating three-dimensional microstructures named localized electrochemical deposition (LECD). Numerical modeling and experiments for LECD have been tightly combined to investigate the deposition mechanism in this paper. The electric field distribution on the cathode surface at the initial time (Os) of electroplating is analyzed to explore the formation of conical copper column. In addition, the surface and cross sectional morphologies were also investigated to evaluate the quality of the deposited copper columns. Results showed that the formation of conical copper columns resulted from the uneven distribution of electric field distribution on the cathode surface. In addition, the number of voids inside the cross section decreases from the bottom to the top of the conical copper column.