共 50 条
- [42] Development of a copper CMP process for multilevel, dual inlaid metallization in semiconductor devices CHEMICAL MECHANICAL PLANARIZATION IN INTEGRATED CIRCUIT DEVICE MANUFACTURING, 1998, 98 (07): : 9 - 18
- [43] Thin copper seed layers in interconnect metallization using the electroless plating process JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2004, 43 (8A): : 5100 - 5104
- [46] MILLING OF COPPER SLAGS FROM NORANDA CONTINUOUS SMELTING PROCESS JOM-JOURNAL OF METALS, 1976, 28 (12): : A46 - A46
- [47] Preparation of copper-graphite composite particles by milling process Journal of Composite Materials, 2012, 46 (22): : 2829 - 2834
- [48] Study of Optimum Bond Pad Metallization Thickness for Copper Wire Bond Process 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 597 - 602