Shape memory behavior of sputter-deposited Ti-Ni-Pd thin films

被引：0
|
作者：
Okutsu, K [1 ]
Hosoda, H [1 ]
Miyazaki, S [1 ]
机构：
[1] Univ Tsukuba, Inst Mat Sci, Tsukuba, Ibaraki 3058573, Japan
来源：
PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II | 2001年
关键词：
shape memory alloy; TI-Ni-Pd; sputter-deposition; thin film; heat-treatment;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Characteristics of Ti-Ni-Pd high temperature shape memory alloy thin films with various Pd contents between 2.3 at% and 35.3 at% were investigated. The thin films were made by the r.f. magnetron sputter-deposition method followed by heat-treatments at 743 K or 973 K for 3.6 ks. Transformation behavior and shape memory characteristics were evaluated by constant stress tests during thermal cycles. It was found that the transformation start temperature M, of Ti-Ni-Pd thin films heat-treated at 973 K was higher than that of the films heat-treated at 743 K. The highest M. was around 560 K in the 52.0Ti-12.7Ni-35.3Pd(at%) thin film heat-treated at 973 K. The critical stress for slip or, and maximum shape recovery strain epsilon(A)(MAX) of the film heat-treated at 743 K are larger than those of the film heat-treated at 973 K. The maximum shape recovery strain of 5.6% was achieved in the 51.2Ti-39.7Ni-9.1 Pd(at%) thin film heat-treated at 743 K.
引用
收藏
页码：1521 / 1523
页数：3
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