Advanced Metrology for Next Generation Transistors

被引:2
|
作者
Diebold, Alain C. [1 ]
机构
[1] SUNY Albany, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA
关键词
SPECTROSCOPIC ELLIPSOMETRY CHARACTERIZATION; OPTICAL FUNCTIONS; THIN-FILM; HFO2; DEFECTS;
D O I
10.1007/978-3-540-85859-1_29
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
This paper overviews advances in optical and electrical measurements for advanced transistor materials and processes. Optical measurements such as ellipsometry require advances in both optical methods and optical measurement, technology [1, 2]. Although laboratory based optical measurements are capable of measuring into the VUV, the availability of in-line systems is a recent development. The Cody Lorentz model is used to describe the optical response of high k materials and advance traditional measurements such as ellipsometry [1]. Electrical measurements provide a well recognized means of quantifying defect states in transistor film stacks. Advanced charge pumping methods extend capacitance - voltage measurements to high k materials [3]. Non-traditional optical approaches such as second harmonic generation which confirm the observation of trapped charge induced changes in the silicon dielectric function by ellipsometry are also discussed [4, 5]. The paper ends with a discussion of impact, of quantum confinement on the optical measurement of thin SOI films [6, 7].
引用
收藏
页码:371 / 383
页数:13
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