Critical temperature to dielectric degradation of printed circuit board

被引：0
|
作者：
Liu, Yong [1 ]
Du, B. X. [1 ,2 ]
Zhang, Xiangjin [2 ]
Jiang, Xin [1 ]
机构：
[1] Tianjin Univ, Sch Elect Engn & Automat, Tianjin 300072, Peoples R China
[2] Tianjin Prof Univ, Tianjin 300072, Peoples R China
来源：
ICPASM 2005: PROCEEDINGS OF THE 8TH INTERNATIONAL CONFERENCE ON PROPERTIES AND APPLICATIONS OF DIELECTRIC MATERIALS, VOLS 1 AND 2 | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Dielectric degradation of printed circuit board based on the thermal properties in an open-air environment was investigated. With increase of the temperature, the copper electrodes were oxidized from CU2O to CuO; the base material of epoxy laminate was thermally affected to the change of molecular structure and degradation of dielectric properties. With increase of the temperature, the capacitance and surface resistance decreased, the thermal stimulated current increased and showed a valley value near 450 K and a peak value near 490 K.
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页码：92 / +
页数：2
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